A synthetic jet-based immersion cooling system for enhancing heat transfer in high-performance electronic equipment

Background

The rapid advancement of high-performance computing and data center technology has led to a dramatic increase in transistor density and processing power, resulting in unprecedented heat generation within electronic systems. Traditional air cooling methods, which rely on fans and heat sinks, are increasingly unable to keep pace with these escalating thermal loads, leading to concerns about system reliability, performance throttling, and energy inefficiency. Immersion liquid cooling has emerged as a promising alternative, offering superior heat removal by submerging electronic components in a dielectric fluid that directly absorbs and dissipates heat. This approach is particularly attractive for modern data centers and high-density server environments, where efficient thermal management is critical to maintaining operational stability and maximizing hardware lifespan.

Despite its advantages, conventional immersion cooling systems face significant limitations that hinder their effectiveness. The primary challenge lies in the reliance on passive or bulk fluid circulation, which often results in the formation of stagnant thermal boundary layers around heat-generating components. These boundary layers act as insulators, impeding efficient heat transfer from the component surfaces to the surrounding liquid. While increasing the flow rate of the cooling liquid can help, it typically requires complex plumbing, high-power pumps, and intricate distribution networks, adding to system complexity, energy consumption, and maintenance demands. Furthermore, existing approaches lack the ability to provide targeted or adaptive cooling to specific hotspots, making it difficult to address localized thermal challenges in heterogeneous electronic assemblies. As a result, there is a pressing need for innovative solutions that can enhance convective heat transfer, disrupt boundary layers, and deliver precise, energy-efficient cooling tailored to the dynamic demands of modern electronic systems.

Technology

This technology is a highly integrated liquid cooling system designed for advanced thermal management of high-density electronic equipment, such as data centers and high-performance computing systems. At its core, the solution combines immersion cooling—where electronic components are fully submerged in a dielectric liquid—with compact, piezoelectric-driven synthetic jet devices that generate secondary cross flows within the cooling bath. Each synthetic jet device consists of a 3D-printed body with a conical cavity, a piezoelectric composite diaphragm, and robust electrical insulation, all engineered to produce pulsating vortex jets that enhance fluid movement and heat transfer. The system features a central coolant distribution unit (CDU) that circulates the cooling liquid through a heat exchanger, while a sophisticated controller dynamically adjusts jet actuation and system parameters in response to real-time sensor feedback on temperatures and operational loads. The modular mounting system allows precise placement of synthetic jets for targeted cooling, and vapor management mechanisms maintain system integrity and fluid levels.

What sets this technology apart is its innovative integration of synthetic jet enhancement within an immersion cooling framework, offering a leap in cooling performance and efficiency. Unlike traditional air or passive immersion cooling, the piezoelectric-driven synthetic jets actively disrupt thermal boundary layers and induce turbulent mixing, dramatically increasing convective heat transfer at critical hotspots. The compact, all-in-one design of each jet device eliminates the need for bulky high-pressure pumps or complex plumbing, reducing system complexity and energy consumption. The use of advanced materials and manufacturing techniques—such as single crystal piezo ceramics for lower voltage operation and custom 3D-printed geometries for optimal vortex formation—ensures high reliability and adaptability to various cooling liquids, including conductive types with proper insulation. The system’s real-time adaptive control, scalability, and ability to deliver precise, localized cooling make it a differentiated solution for managing the escalating thermal demands of modern electronic infrastructure.

Benefits

• Significantly enhanced heat transfer efficiency through synthetic jet-induced vortex flows
• Compact, integrated design reduces system complexity and energy consumption
• Precise, targeted cooling of high-heat electronic components for improved thermal management
• Safe operation with dielectric or electrically conductive cooling liquids due to effective insulation
• Dynamic, real-time control of cooling parameters based on sensor feedback for optimal performance
• Modular and scalable system architecture adaptable to various equipment configurations
• Improved reliability and durability via custom manufacturing and robust materials
• Advanced immersion cooling combined with active flow enhancement for superior cooling in high-density electronics

Applications

• Data center immersion cooling
• High-performance server cooling
• GPU/ASIC mining rig cooling
• Telecom equipment thermal management
• Edge computing device cooling

Additional info

This advanced liquid cooling system employs compact, piezoelectric-driven synthetic jet generators. Oscillating diaphragms create pulsating pressure, forming vortex rings that generate targeted cross-flows. These flows disrupt thermal boundary layers, significantly enhancing convective heat transfer for high-performance electronics in immersion baths, without requiring traditional high-pressure pumps.